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Possible causes of failure analysis: burnout, instantaneous high current access, overvoltage and overcurrent lead to device breakdown, not in accordance with the product manual correct access to power, the product surface adsorption of conductive substances, resulting in short circuit.
Suggestions: increase the voltage stabilization power supply to ensure that the power supply is stable and normal, in accordance with the product manual, select the power supply and correct access, away from the construction site to avoid the adsorption of conductive substances, resulting in a power supply short circuit, burned motherboard